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Circuitus XQ6SLX150(plena range cash)

Description:

opificem:Intel Xilinx

Manufacturer producti numeri: XQ6SLX150-2CSG484I

describe: IC FPGA 326 I/O 484FBGA

Detailed Description:series Field Programmable Gate Array (FPGA) IC 326 4939776 101261 ​​484-BBGA


Product Detail

Product Tags

modulus;

parametri nomen attributum valorem
Estne Rohs certificatus? occurrat
Commercium Nomina XILINX (Xilinx)
Obsequium Code compli
ECCN code 3A991.D
maxime horologium frequency 667 MHz
JESD-30 code S-PBGA-B484
JESD-609 codice e1
Umor sensus Level 3
numerus entries 338
Numerus unitas rationis 147443
output temporibus 338
Numerus terminalum 484
Sarcina corpus materiale Plastic/EPOXY
sarcina codice FBGA
Equivalent code encapsulate BGA484,22X22,32
Package figura QUADRATUM
Forma sarcina GRID ACIES, PIX
Pecco Reflow Temperature (Celsius) 260
potentia copia 1.2,1.2/3.3,2.5/3.3 V
Programmabilis Logica Type AGRUM PROGRAMMABILIS PORTA ACIES
Certification status Non secundum quid
superficies montis ETIAM'
technologia CMOS
Terminatio superficies stannum argenteum
Terminatio forma SPHERA
Terminatio picis 0.8 mm
Terminatio locus BOTTOM
Maximum tempus ad apicem reflow temperatus 30

Communia :
Xilinx® 7 series FPGAs comprehendunt quattuor familias FPGA, quae integram amplitudinem systematis requiruntur, e parvo pretio, parva forma factoris vagantes;
cost-sensitivum, altum volumen applicationes ad finem connectivity ultra longitudinis, capacitatis logicae, et insignem processui facultatem pro gravissima
summus effectus est.Series VII FPGAs includit:
• Spartan®-7 Family: Optimized for low cost, infima potestas, and high
I/O perficiendi.Available in parvo pretio, valde parva forma factoris
packaging pro minimo PCB vestigium.
• Artix®-7 Genus: Optimised ad vim applicationes humilis Vide requirens
transceptores et alta DSP et logica throughput.Ima praebet
summa rogationis materiae sumptus pro summus throughput, cost-sensitivo
utilibus.
• Kintex®-VII Genus: Optimized pro optimo pretio-perficiendi cum 2X
melius comparatur generationi priori, ut novum genus
of FPGAs.
• Virtex®-7 Genus: Optimized pro summa ratio perficiendi et
facultatem cum 2X emendationem in systemate perficiendi.altissimum
facultatem machinas per reclinant Pii interconnect (SSI)
amplificatur.
Super statu-de arte, summus perficientur, humilis potentia (HPL), 28 um, summus k porta metallica (HKMG) processus technologiae, 7 series FPGAs efficiunt
2.9 Tb/s of I/O band, 2.9 million logic cell facultatem, 5.3 TMAC/s DSP incomparabili incremento cum 2.9 Tb/s of I/O
potentia quam cogitationes generationis antecedens ut ASSPs et ASICs plene programmabilem offerant.
Summary of 7 Series FPGA Features
• Provectus summus perficientur FPGA logica secundum realem 6-input aspectum
mensa (LUT) technologiae configurable ut memoriae distributa.
• 36 Kb dual-portus scandalum RAM cum aedificatis in FIFO logicis pro in-chip data
buffering.
• High-perficiendi SelectIO™ technology cum auxilio DDR3
interfaces usque ad 1,866 Mb/s.
• Vide connectivity summus celeritas cum transceivers multi gigabit constructum-
ab 600 Mb/s ad max.rates de 6.6 Gb/s usque ad 28.05 Gb/s, oblatio a
peculiaris humilis potentiae modus, optimized pro chip-ad-chip interfaces.
• A user configurable analog interface (XADC), incorporatio dualis
XII frenum 1MSPS analog-ad-digital converters cum on-chip scelerisque ac
supplere sensoriis.
• DSP pecias cum 25 x 18 multiplicatoris, accumulatoris 48-bit, et praecellentis aspis
pro summus perficientur eliquare, inter optimized symmetrica
coefficiens eliquare.
• Validus horologii procuratio tegularum (CMT) iungendo tempus-clausum
ansa (PLL) et horologium mixtum-modus procurator (MMCM) caudices ad altum
subtilitas et humilis Jitter.
• Celeriter processus embedded cum MicroBlaze™ processus explicas.
• Integrated scandalum PCI Express® (PCIe), usque ad x8 Gen3
Endpoint and Radix Portus designs.
• Lata varietas optionum configurationis, inter subsidium
mercimoniarum memoriam, 256-bit AES encryption cum HMAC/SHA-256
authenticas, constructas seu detectas et correctiones.
• Minimum-cost, filum-vinculum, nudum-moriturum flip-chip, et altae notae integritatis flip
chip packaging offering facilis migratio inter familia membra in
eadem sarcina.All packages available in PB-free and selected
packages in Pb option.
• Designed for high performance and lowest power with 28 um,
HKMG, HPL processus, 1.0V core processus technologiae voltage and
0.9V core intentione bene pro viribus etiam inferioribus.


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