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10M08SAU169C8G Contactus mos muneris (21+ macula venditionesque)

Description:

Boyad Part Number :544-3135-ND
manufacturer: Intel
Manufacturer productum numerus: 10M08SAU169C8G
describe: IC FPGA 130 I/O 169UBGA
Detailed Description: series Field Programmable Gate Array (FPGA) IC 130 387072 8000 169-LFBGA
Customer Internum Number
Formularium: Specificationes


Product Detail

Product Tags

proprietatibus productum

EXEMPLUM PERSEQUOR
genus Integrated Circuit (IC)
Embedded - FPGA (porta agri Programmabilis Forum)
manufacturer Intel
series MAX® 10
sarcina lance
productum status in stirpe
Numerus LAB/CLB 500
Numerus elementorum logicae / unitates 8000
Summa ram bits 387072
I / O comitem 130
Voltage - Powered 2.85V ~ 3.465V
genus institutionem Superficiem Monte Type
Operating Temperature 0°C ~ 85°C (TJ)
Sarcina / clausura 169-LFBGA
Supplementum Fabrica Packaging 169-UBGA (11x11)

referre ugbay
Nova Inquisitio Parametrica

Documenta et Media

RESOURCE EXEMPLUM LINK
Specifications MAX 10 FPGA Overview MAX 10 FPGA Fabrica Datasheet
Modulorum institutio productum MAX10 Motor Control utens uno-Chip low-Pretium Non volatile FPGA  MAX10 Substructio Ratio Management
producti insigniti T-Core PlatformEvo M51 Compute Module Hinj™ FPGA Sensor Hub et Development Kit XLR8: Arduino Compatible FPGA Development Board
PCN Design/Specification Max10 Pin Guide 3/Dec/2021Mult Dev Software Chgs 3/Jun/2021
PCN sarcina Mult Dev Label Chgs 24/Feb/2020Mult Dev Label CHG 24/Jan/2020
HTML Specifications MAX 10 FPGA OverviewMAX 10 FPGA Fabrica Datasheet
EDA / CAD exemplar 10M08SAU169C8G by SnapEDA

Environment et Exporting Classification

ATTRIBUTES PERSEQUOR
RoHS status RoHS facilis
Humorem Sensitivum Level (MSL) III (CLXVIII horas)
SPATIUM status Non products SPATIUM
ECCN 3A991D
HTSUS 8542.39.0001

Embedded Multipliers et Digital signum Processing Support
Usque ad XVII unius externum inputs finita-
nam una ADC cogitationes
Una dedicata analog et 16 munus duale initus fibulae
Ad XVIII externa inputs-unum finita
duplicem ADC machinas
• Dedicatum analogum et octo functiones duplices initus clavi in ​​unoquoque ADC clausus
• mensurae simultaneae capacitatem duplicem ADC machinis
In-chip temperatus sensorem Monitores externae caliditatis datae input cum sampling rate of up to 50
kilosamples secundo
User Flash Memoria
Usoris mico memoria (UFM) inusitatus in Intel MAX 10 machinis thesauris non-volatilibus
indicium.
UFM solutionem repositionis optimam praebet ut accedere possis utens Avalon Memoriae Mapped (Avalon-MM) servi interfaciei protocollum.
Embedded Multipliers et Digital signum Processing Support
Intel MAX 10 machinis adiuvantibus usque ad 144 in cuneos multiplicatorum infixa est.Quisque obstructionum
sustinet unum individuum 18 18-bis multiplicatorem vel alterum individuum 9 × 9-bis multiplicatorem.
Cum concursu opibus et instrumentorum externorum in Intel MAX 10
machinis, DSP systemata alta perficientur, humilis ratio et humilis edificare potes
potentia consummatio.
Intel MAX 10 fabrica uti potes per se vel in fabrica co-processus DSP ad
emendare pretium-ad-faciendi rationes systematum DSP.
Operationem multiplicatoris embedded in cuneos utendo regere potes
optiones:
• Parameterize pertinentes nucleos IP cum Intel Quartus Primus editor parameter
• multiplicatores directe cum VHDL vel Verilog HDL infer
Systema notae designationis pro Intel MAX 10 machinis providentur:
• DSP IP coros:
- Commune DSP processus functiones sicut impetus finitus responsio (FIR), velociter
Fourieriani transform (FFT), et numero moderato oscillatoris (NCO) functionum
- Consentaneus communis video et imago processus functiones
• The reference designs ad finem-market applications
• DSP conditor pro Intel FPGAs instrumenti interfaciendi inter Intel Quartum Primum
software and the MathWorks Simulink and MATLAB design ambitus
• DSP progressio rhoncus posuere
Memoria embedded obstruit
Memoria infixa structura ex M9K memoria in columnis consistit.quisque M9K
memoria obstructionum de Intel MAX 10 fabrica praebet 9 Kb of on-chip memoria capax
operando usque ad 284 MHz.Memoriae structurae embedded in M9K est
memoria cuneos columnarum.Quisque M9K memoria obstructionum de Intel MAX X fabrica praebet
9 Kb of on-chip memoria.In memoria caudices potes latius vel altius formare
logicae structurae.
M9K caudices memoriae configurare potes ut RAM, FIFO buffers vel ROM.
Intel MAX 10 fabrica memoriae caudices optimized sunt pro applicationibus ut summus
throughput processus fasciculus, processus embedded programmatis et notitia embedded
repono.


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